Laser Glass Processing Machine

Laser Glass Processing Machine

     Laser machine for glass drilling, cutting, and more

  • Drillable hole size 50 µm to 50 mm
  • Substrate thickness from 50 µm to 8 mm
  • Drilling speed up to 30 mm/s (0.5 mm glass)
  • Scribing/marking speed up to 2000 mm/s
  • Tolerance: < 50 µm
  • Standalone and in-line system
  • Customized laser solution available for various applications

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Mechanical Characteristics:

Parameter Specification
Mechanics

Solid granite material for base

Class 1 laser safety enclosure

System control CNC control
Laser sources 515/1030 nm, nano/picosecond lasers
Beam delivery Scanning laser beam
Working area

X-axis 250 mm, linear motor

Y-axis 250 mm, linear motor

Z-axis 100 mm, ball screw

Vision system Integrated in standard configuration

(For special requirement, please contact AdValue Phontonics for options.)

General Characteristics:

Parameter Specification
Operating temperature 10 to +30 °C
Storage temperature +5 to +70 °C
Cooling Water cooled (portable chiller available as an option)
Power requirement 110-240 V, up to 4.5 kW
Exhaust system Industrial dust extracting and filtering
Consumables Electrical power, compressed air, cooling water
  • Laser cutting, drilling and scribing (glass, sapphire, silicon, silicon carbide,  ceramics, nitinol stents, CFRP, PCD and CVD diamond)
  • Laser thin film patterning (TCO, metal, thin film solar cells) 
  • 2.5D surface shaping (metals, ceramics, plastics) 
  • Laser marking (glass, sapphire, silicon carbide, silicon, metals, plastics)