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Laser machine for glass drilling, cutting, and more
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Mechanical Characteristics:
Parameter | Specification | |||
Mechanics |
Solid granite material for base Class 1 laser safety enclosure |
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System control | CNC control | |||
Laser sources | 515/1030 nm, nano/picosecond lasers | |||
Beam delivery | Scanning laser beam | |||
Working area |
X-axis 250 mm, linear motor Y-axis 250 mm, linear motor Z-axis 100 mm, ball screw |
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Vision system | Integrated in standard configuration |
(For special requirement, please contact AdValue Phontonics for options.)
General Characteristics:
Parameter | Specification |
Operating temperature | 10 to +30 °C |
Storage temperature | +5 to +70 °C |
Cooling | Water cooled (portable chiller available as an option) |
Power requirement | 110-240 V, up to 4.5 kW |
Exhaust system | Industrial dust extracting and filtering |
Consumables | Electrical power, compressed air, cooling water |
- Laser cutting, drilling and scribing (glass, sapphire, silicon, silicon carbide, ceramics, nitinol stents, CFRP, PCD and CVD diamond)
- Laser thin film patterning (TCO, metal, thin film solar cells)
- 2.5D surface shaping (metals, ceramics, plastics)
- Laser marking (glass, sapphire, silicon carbide, silicon, metals, plastics)